Forced air convection reflow oven

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Product Feature

Forced air convection heat to maximum temperatures up to 300°C for lead free soldering. Forced air convection provides uniform heating and prevents shadowing.
Three heat zones, each independently controlled for accurate temperature profiles.
Bench-top unit can be converted to a stand-alone unit by use of the optional cabinet and also integrated into a fully conveyorized production line.
Viewing panel allows visual inspection of reflow process.
Detachable thermocouple for measuring substrate temperatures.

The Mistral 260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile.
By eliminating set-up time your production line can work to its fullest capacity.

Convection heating provides many other advantages over IR.
In addition to the wide process window

it works with
No shadowing
No belt load sensivity
No cold solder joints
No colour sensitivity
No hot spots

▶ 3 zone temperature control
With a belt width of 265mm(over 10”) and consistent temperature across the entire width the Mistral can easily accommodate your entire production line speeds up to 0.6 meters/minute.

▶ Environment friendly
“Environment friendly” is more then just a catch to the Mistral designers.
With reduced energy consumption and carefully controlled air-flow and exhaust systems, your plant will only benefit from its introduction.
Ease of access to all parts of the machine ensures fast and easy maintenance.
Managing information is quickly available and ancillary processes, such as glue curing, are easily programmed.
The Mistral 260 reflow system is built to last and to perform to the highest standards throughout its long lifetime.

▶ Product Specification
Power requirements: 208/240VAC 1-phase
Rated power max.: 3650 Watts
Temperature regulation accuracy: 1°C
Stainless steel spring wires conveyor belt
Conveyor speed: 15 - 60 cm/min(6 - 23 inch/min)
Soldering temperatures typ: 180 - 300°C
Clearance for assemblies up to 25mm(1 inch)
Soldering width: 265 mm(10 inch)
Length process chamber: 860 mm(43 inch)
Bottom cooling fans at offload section
Heat-up time: approx. 15 min.
Dimensions: 1540 x 600 x 360 mm(L x W x H)
Net weight: 60 kg