Time/Temperature Control Segments
Allow Simulation of In-Line Reflow

The ability to divide a single processing cycle into as many as 40 different time/temperature
control segments allows precise temperature profiling that will simulate the exact environment
to which a PCB assembly would be exposed in an in-line reflow system.
This level of control provides process characterization
that allows smooth transitions from prototyping and development work to higher volume production.

Real-Time Temperature Monitoring
and Data Acquisition

Real-time monitoring of the T200C temperature during the process cycle
allows actual values to be compared to set values for precise parameter adjustment.
The ability to save and print process data is also ideal for training, development,
and even quality control documentation.

A Simple Solution for Your Low Volume
Lead-Free Reflow Needs

The T200C features a front-load heating chamber with a sturdy pull-out drawer
and PCB holder for assemblies up to 360 mm x 230 mm.
A tempered glass window allows the user to view the reflow process.

Infrared and Forced Convection
Combine for Efficient Lead-Free Reflow

Tubular quartz infrared heaters and an internal air circulation system
provide a combination of IR and forced hot air convection heating
that is ideal for fast, efficient, and uniform batch reflow soldering.
All system components are easily accessible for cleaning and maintenance.

Compact Bench-Top Design Ideal for Labs,
Schools, Low-Volume Job Shops

The compact design and construction of the T200C
allows bench-top operation in tight quarters where space is at a premium.
At a weight of only 45 kg 
and a footprint of only 1/3 of a square meter the T200C can be installed virtually anywhere.